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In thinking more about the case, I'd say the only reason for going metal would be for EMI shielding.
The curtis case helps convect heat away because it's a 1 piece extrusion. The components are on the bottom and heat conducts through the metal at the bottom to the sides and top of the case where it then dissipates to the air (in addition to conducting to any added heatsink on the bottom). I doubt very much heat makes it from component to inside-air to case to outside-air. Maybe some will radiate, but I bet there's just too much thermal resistance. It's way easier for heat to go through the heat spreader and heatsink, so most of it will.
I'm not sure how to comment on EMI though... If it ain't broke, do we need to fix it?
Perhaps cost and manufacturability are more important design drivers for a case. Cheap and easy!
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