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I think that because the copper heat spreader is in direct contact (being pressed with like a 1000 pounds or whatever because of five 1/4 inch bolts torqued down) with the heatsink, the heat transfer from the mosfets/diodes to the base is pretty efficient. I think heat only rises in fluids, because the cold sinks, because it's more dense. With an aluminum case, thanks to Hondo, I'm guessing that if the case is bolted to the base plate, that the plate should transfer heat pretty efficiently to the case, sort of like the Curtis.
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