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To adamj12b: Your set up looks like a good plan. It's hard to tell from the pics, but I think I'm seeing that you've installed the MOSFETs and diodes face-down onto the heat sink. If so, I'm afraid you won't get enough heat transfer since the components are designed to dissipate about 90% of their heat through the back (subplate). Can you flip things over? The diodes would be able to flip, but the MOSFETs would have to be re-configured on the board.
-edown
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