Through hole is friendlier for DIY stuff, most people won't know how to look for/avoid hairline cracks on those SMT resistors and caps. Plus a good flex in the board can cause that too.. and the larger 2225 packages get really finicky about how you solder them.
That said, with proper mechanical support and soldering it normally isn't an issue. Not only that but the reduced weight of the parts can make it more resilient against vibration. That might be TH's largest weakness unless you pot the board. Also the smaller size helps a lot, even in stuff like this where you normally wouldn't think of space as a huge constraint. With higher frequency stuff it also keeps the traces short and the drive stuff packed densely together with a solid ground plane underneath, shielded in a way that through hole makes impossible. This is all sub 100khz so not really a factor, just rambling on I suppose.
I think a mix is best.. if the board will have mechanical screw connections to the IGBT's or large caps then the board will flex, best to use TH in that area. A sub-board with the micro which is isolated from this stressing and heat would probly be better off SMT.
Last edited by Automcdonough; 09-23-2010 at 10:31 PM..
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