fwiw
It may be worth baking the mosfets for 24 hours prior to soldering at about 30-50C - that helps get rid of any moisture the package may have absorbed - it's a reasonably common procedure. The cooling probably shouldn't be more violent than a cool air blower; too bigger dT/dt can be quite damaging, due to differential coefficients of expansion. (or contraction)
Regards,
Roche
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