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The wafer fab I worked at did everything in that video, except lithography. I was there when they added the 300mm fab process, keeping the 200mm process.
The 200mm process had people shuffling wafers manually using carts like in the video, even moving them between separate buildings.
The 300mm process was contained in a contiguous building and OHT (overhead transport) was used. Wafers were rarely manually handled. The pullers were way more complex than the 200mm ones. The quartz crucibles could only be used twice because part of their function was to absorb oxygen, and it could only do this effectively twice. Supercooled, superconducting magnets were also used to reduce oxygen content.
The company was considering expanding the 200mm process around when I left a little over 5 years ago. To do so, they would have to expand their building floor space. I thought it crazy to expand the old process back then, but now maybe it wasn't such a crazy idea.
I kinda think we need to be printing PV, not using billion dollar fabs to make inflexible wafers. Hopefully that technology pans out.
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