Hi Adam,
I also wanted to comment on you placing the Mosfets and Diodes are on the bottom side clamped to the heat-sink through the PCB.
I like the idea of a Sandwich Power PCB Layout, heatsink on top, PCB in the middle with the Mosfet’s facing up and the capacitors and electronics facing down, and buss bars on the bottom. I also envisioned the Mosfets mounted to an aluminum plate that would allow a modular heatsink or water jacket to be bolted to it on the opposite side.
Another idea I had was to make 100 Amp power modules that could be modularly configured, 500A, 1000A, 1500A, etc… The layout would use (1) IRFP4668 and (2) STTH6002, and (2) 820uf caps. The configuration would allow for 100A – 120A operation.
Regards,
Mark