I hadn't meant that, but I see what you mean. In looking at possible ways to improve cooling, I noticed that the bent portion of the case could provide additional heat sinking if it had some thermal paste where it joins the plate. Also, better air flow inside if the mounting board were perforated. Any objections to swapping some pre-perfed material here?
Last edited by xtian999; 12-29-2009 at 05:55 PM..
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