Thanks to CamLight for the clearheaded Type III description.
But... if we're still talking about the power section of the controller, the goal is still to conduct 500A. (or 1000A.). It seems that the power section of the design may have a new configuration. Controlled MosFETs, electrically and thermally conducting in parallel through a buss bar, which is then cooled by an electrically isolated, thermally conductive member. Which sounds like the possibility for a very rugged chassis mounting scheme.
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