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Old 02-28-2010, 06:59 PM   #3025 (permalink)
CamLight
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Quote:
Originally Posted by chapper View Post
Thanks to CamLight for the clearheaded Type III description.
But... if we're still talking about the power section of the controller, the goal is still to conduct 500A. (or 1000A.). It seems that the power section of the design may have a new configuration. Controlled MosFETs, electrically and thermally conducting in parallel through a buss bar, which is then cooled by an electrically isolated, thermally conductive member. Which sounds like the possibility for a very rugged chassis mounting scheme.
Ahh...so the FETs would be mounted on a bare (copper?) bus bar that would act as a heat spreader and also conduct the current out? And then the bus bar would be mounted to an electrically insulated heat sink to get rid of the heat?

What FET case type/size was selected for the high-amp configuration? Were they just going to be screwed or clamped against the bus bar (without a thermal transfer compound)?
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