Whouahh !!!
I see the B+ bus bar is directly in contact with the high side mosfets drain, and phase outputs are directly in contact with the low side mosfets drain, thus everything will be probably directly placed and screwed on the base plate ? IE : base pate --> isolation film -> bus bar and phases bar --> mosfets, the screw tightening the 4 together ?
It mean you cannot disassemble everything when the power board is solder on mosfet ?
And the 2 small pcb on the phase bar on the right are the current sensors !?? Seems to be great, where do you find that !? Is it hall technology or they measure the small potential difference between the 2 fixation holes ?
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