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Always appreciate the expert comments JSH.
My understanding of manufacturing comes form the silicon wafer industry. Every process has a bottleneck, or some limiting factor that doesn't allow for increased production rates. At my particular place of employment, that was the double-side polish process.
Anyhow, any extra step adds cost, a bit of time, and the potential for problems. In the silicon wafer world, each step involves a certain percent of "breakage". Perhaps the reject rate for unpainted body panels will be lower than the reject rate for painted panels. I've got no idea if it's a more cost effective production strategy, but it's going to be neat to see the experiment. I wonder if Munro has enough expertise to evaluate the efficiency of that manufacturing process?
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